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Agilent HFBR-53A3VEM/HFBR-53A3VFM 3.3 V 1 x 9 Fiber Optic Transceivers for Fibre Channel
Data Sheet
Features * Compliant with ANSI X3.297-1996 Fibre Channel Physical Interface FC-PH-2 revision 7.4 proposed specification for 100-M5-SN-I and 100-M6-SN-I signal interfaces * Performance HFBR-53A3VEM/FM: 300 m links in 62.5/125 m MMF cables 500 m links in 50/125 m MMF cables * Wave solder and aqueous wash process compatible * Industry standard mezzanine height 1 x 9 package style with integral duplex SC connector * IEC 60825-1 Class 1/CDRH Class I laser eye safe * Single +3.3 V power supply operation with PECL compatible logic interfaces and TTL Signal Detect Applications * Mass storage systems I/O * Computer systems I/O * High-speed peripheral interface * High-speed switching systems * Computer systems I/O * Host adapter I/O * RAID cabinets Related Products * Physical layer ICs available for optical or copper interface (HDMP-1636A/1646A) * Versions of this transceiver module also available for +5 V operation (HFBR/HFCT-53D3) * MT-RJ SFF fiber optic transceivers for Fibre Channel (HFBR-HFCT-5910E) * Gigabit Interface Converters (GBIC) for Fibre Channel: HFBR-5602 (SWL) and HFCT-5612 (LWL)
Description The HFBR-53A3VEM/FM transceivers from Agilent Technologies allow the system designer to implement a range of solutions for multimode Fibre Channel applications. The overall Agilent transceiver product consists of three sections: the transmitter and receiver optical subassemblies, an electrical subassembly, and the package housing which incorporates a duplex SC connector receptacle. Transmitter Section The transmitter section of the HFBR-53A3VEM/FM consists of an 850 nm Vertical Cavity Surface Emitting Laser (VCSEL) in an Optical Subassembly (OSA), which mates to the fiber cable. The OSA is driven by a custom, silicon bipolar IC which converts differential PECL compatible logic signals into an analog laser diode drive current. The high speed output lines are internally ac-coupled and differentially terminate with a 100 resistor.
Receiver Section The receiver of the HFBR-53A3VEM/FM includes a GaAs PIN photo-diode mounted together with a custom, silicon bipolar transimpedance preamplifier IC in an OSA. This OSA is mated to a custom silicon bipolar circuit that provides postamplification and quantization. The post-amplifier also includes a Signal Detect circuit which provides a TTL logic-high output upon detection of a usable input optical signal level. The high speed output lines are internally ac-coupled.
Package and Handling Instructions Flammability The HFBR-53A3VEM/FM transceiver housing is made of high strength, heat resistant, chemically resistant, and UL 94V-0 flame retardant plastic. Recommended Solder and Wash Process The HFBR-53A3VEM/FM is compatible with industrystandard wave or hand solder processes. Process Plug This transceiver is supplied with a process plug (HFBR-5000) for protection of the optical ports within the duplex SC connector receptacle. This process plug prevents contamination during wave solder and aqueous rinse as well as during handling, shipping, and storage. It is made of a hightemperature, molded sealing material that can withstand 80 C and a rinse pressure of 110 lbs per square inch. Recommended Solder Fluxes Solder fluxes used with the HFBR-53A3VEM/FM should be water-soluble, organic fluxes. Recommended solder fluxes include Lonco 3355-11 from London Chemical West, Inc. of Burbank, CA, and 100 Flux from Alpha-Metals of Jersey City, NJ. Recommended Cleaning/Degrading Chemicals Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane, heptane. Other: soap solution, naphtha. Do not use partially halogenated hydrocarbons such as 1,1.1 trichloroethane, ketones such as MEK, acetone, chloroform, ethyl
acetate, methylene dichloride, phenol, methylene chloride, or N-methylpyrolldone. Also, Agilent does not recommend the use of cleaners that use halogenated hydrocarbons because of their potential environmental harm. Regulatory Compliance (See the Regulatory Compliance Table for transceiver performance) The overall equipment design will determine the certification level. The transceiver performance is offered as a figure of merit to assist the designer in considering their use in equipment designs. Electrostatic Discharge (ESD) There are two design cases in which immunity to ESD damage is important. The first case is during handling of the transceiver prior to mounting it on the circuit board. It is important to use normal ESD handling precautions for ESD sensitive devices. These precautions include using grounded wrist straps, work benches, and floor mats in ESD controlled areas. The transceiver performance has been shown to provide adequate performance in typical industry production environments. The second case to consider is static discharges to the exterior of the equipment chassis containing the transceiver parts. To the extent that the duplex SC connector receptacle is exposed to the outside of the equipment chassis it may be subject to whatever system-level ESD test criteria that the equipment is intended to meet. The transceiver performance is more robust than typical industry equipment requirements of today.
Electromagnetic Interference (EMI) Most equipment designs utilizing these high-speed transceivers from Agilent will be required to meet the requirements of FCC in the United States, CENELEC EN55022 (CISPR 22) in Europe and VCCI in Japan. Refer to EMI section (page 4) for more details. Immunity Equipment utilizing these transceivers will be subject to radio-frequency electromagnetic fields in some environments. These transceivers have good immunity to such fields due to their shielded design. Eye Safety These laser-based transceivers are classified as AEL Class I (U.S. 21 CFR(J) and AEL Class 1 per EN 60825-1 (+A11). They are eye safe when used within the data sheet limits per CDRH. They are also eye safe under normal operating conditions and under all reasonably forseeable single fault conditions per EN60825-1. Agilent has tested the transceiver design for compliance with the requirements listed below under normal operating conditions and under single fault conditions where applicable. TUV Rheinland has granted certification to these transceivers for laser eye safety and use in EN 60950 and EN 60825-2 applications. Their performance enables the transceivers to be used without concern for eye safety up to maximum volts transmitter V CC .
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CAUTION: There are no user serviceable parts nor any maintenance required for the HFBR-53A3VEM/FM. All adjustments are made at the factory before shipment to our customers. Tampering with or modifying the performance of the HFBR-53A3VEM/FM will result in voided product warranty. It may also result in improper operation of the HFBR-53A3VEM/FM circuitry, and possible overstress of the laser source. Device degradation or product failure may result.
Connection of the HFBR-53A3VEM/FM to a nonapproved optical source, operating above the recommended absolute maximum conditions or operating the HFBR-53A3VEM/FM in a manner inconsistent with its design and function may result in hazardous radiation exposure and may be considered an act of modifying or manufacturing a laser product. The person(s) performing such an act is required by law to recertify and reidentify the laser product under the provisions of U.S. 21 CFR (Subchapter J).
Regulatory Compliance Feature Electrostatic Discharge (ESD) to the Electrical Pins Electrostatic Discharge (ESD) to the Duplex SC Receptacle Electromagnetic Interference (EMI)
Test Method MIL-STD-883C Method 3015.4 Variation of IEC 801-2
Performance Class 1 (>1500 V)
Immunity
FCC Class B CENELEC EN55022 Class B (CISPR 22A) VCCI Class I Variation of IEC 801-3
Typically withstand at least 15 kV without damage when the duplex SC connector receptacle is contacted by a Human Body Model probe. Margins are dependent on customer board and chassis designs.
Laser Eye Safety and Equipment Type Testing
US 21 CFR, Subchapter J per Paragraphs 1002.10 and 1002.12 EN 60825-1: 1994 + A11:1996 EN 60825-2: 1994 + A1 EN 60950: 1992 + A1 + A2 + A3 +A4 + A11
Typically show no measurable effect from a 10 V/m field swept from 27 to 1000 MHz applied to the transceiver without a chassis enclosure. AEL Class I, FDA/CDRH HFBR-53A3V*M Accession #2071022
AEL Class 1, TUV Rheinland of North America HFBR-53A3V*M: Certificate #R9771018.5 Protection Class III
Component Recognition
Underwriters Laboratories and Canadian Standards Association Joint Component Recognition for Information Technology Equipment Including Electrical Business Equipment.
UL File E173874
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APPLICATION SUPPORT Optical Power Budget and Link Penalties The worst-case Optical Power Budget (OPB) in dB for a fiberoptic link is determined by the difference between the minimum transmitter output optical power (dBm avg) and the lowest receiver sensitivity (dBm avg). This OPB provides the necessary optical signal range to establish a working fiber-optic link. The OPB is allocated for the fiber-optic cable length and the corresponding link penalties. For proper link performance, all penalties that affect the link performance must be accounted for within the link optical power budget. Data Line Interconnections Agilent's HFBR-53A3VEM/FM fiber-optic transceiver is designed for compatible PECL signals. The transmitter inputs are internally ac-coupled to the laser driver circuit from the transmitter input pins (pins 7, 8). The transmitter driver circuit for the laser light source is an ac-coupled circuit. This circuit regulates the output optical power. The regulated light output will maintain a constant output optical power provided the data pattern is reasonably balanced in duty factor. If the data duty factor has long, continuous state times (low or high data duty factor), then the output optical power will gradually change its average output optical power level to its pre-set value.
The receiver section is internally ac-coupled between the preamplifier and the post-amplifier stages. The actual Data and Databar outputs of the post-amplifier are ac-coupled to their respective output pins (pins 2, 3). Signal Detect is a single-ended, TTL output signal that is dc-coupled to pin 4 of the module. Signal Detect should not be ac-coupled externally to the follow-on circuits because of its infrequent state changes. Caution should be taken to account for the proper interconnection between the supporting Physical Layer integrated circuits and this HFBR-53A3VEM/FM transceiver. Figure 3 illustrates a recommended interface circuit for interconnecting to a dc PECL compatible fiber-optic transceiver. Eye Safety Circuit For an optical transmitter device to be eye-safe in the event of a single fault failure, the transmitter must either maintain normal, eye-safe operation or be disabled. In the HFBR-53A3VEM/FM there are three key elements to the laser driver safety circuitry: a monitor diode, a window detector circuit, and direct control of the laser bias. The window detection circuit monitors the average optical power using the monitor diode. If a fault occurs such that the transmitter DC regulation circuit cannot maintain the preset bias conditions for the laser emitter within 20%, the transmitter will automatically be disabled. Once this has occurred, only an electrical power reset will allow an attempted turn-on of the transmitter.
Signal Detect The Signal Detect circuit provides a TTL low output signal when the optical link is broken or when the transmitter is off. The Signal Detect threshold is set to transition from a high to low state between the minimum receiver input optional power and -30 dBm avg. input optical power indicating a definite optical fault (e.g., unplugged connector for the receiver or transmitter, broken fiber, or failed far-end transmitter or data source). A Signal Detect indicating a working link is functional when receiving encoded 8B/10B characters. The Signal Detect does not detect receiver data error or error-rate. Data errors are determined by signal processing following the transceiver. Electromagnetic Interference (EMI) One of a circuit board designer's foremost concerns is the control of electromagnetic emissions from electronic equipment. Success in controlling generated Electromagnetic Interference (EMI) enables the designer to pass a governmental agency's EMI regulatory standard; and more importantly, it reduces the possibility of interference to neighboring equipment. The EMI performance of an enclosure using these transceivers is dependent on the chassis design. Agilent encourages using standard RF suppression practices and avoiding poorly EMI-sealed enclosures.
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Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Storage Temperature Supply Voltage Transmitter Differential Input Voltage Relative Humidity TTL Signal Detect Output Current - Low TTL Signal Detect Output Current - High Symbol TS VCC VD RH IOLMAX IOHMAX Min. -40 -0.5 5 -5.0 Typ. Max. +100 5.0 2.2 95 4.0 Unit C V V % mA mA Reference 1
Recommended Operating Conditions Parameter Ambient Operating Temperature Case Temperature Supply Voltage Power Supply Rejection Transmitter Differential Input Voltage Received Data Output Load TTL Signal Detect Output Current - Low TTL Signal Detect Output Current - High Symbol TA TC VCC PSR VD RDL IOL IOH Min. 0 0 3.14 0.4 50 1.0 -400 Typ. Max. +70 +80 3.47 1.6 Unit C C V mVP-P V mA A Reference 2 3
100
Process Compatibility Parameter Hand Lead Soldering Temperature/Time Wave Soldering and Aqueous Wash Symbol TSOLD/tSOLD TSOLD/tSOLD Min. Typ. Max. +260/10 +260/10 Unit C/s C/s Reference 4
Notes: 1. The transceiver is Class 1 eye safe up to VCC = 5.0 V. 2. Case temperature measurement referenced to the metal housing. 3. Tested with a 100 mVP-P sinusoidal signal in the frequency range from 10 Hz to 2 MHz on the V CC supply with the recommended power supply filter (with C8) in place. Typically less than a 1 dB change in sensitivity is experienced. 4. Aqueous wash pressure < 110 psi.
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HFBR-53A3VEM/FM, 850 nm VCSEL Transmitter Electrical Characteristics (TA = 0C to +70C, VCC = 3.14 V to 3.47 V) Parameter Supply Current Power Dissipation Laser Reset Voltage Symbol ICCT PDIST VCCT-reset Min. Typ. 55 0.18 2.5 Max. 75 0.26 2.0 Unit mA W V Reference
1
Receiver Electrical Characteristics (TA = 0C to +70C, VCC = 3.14 V to 3.47 V) Parameter Supply Current Power Dissipation Data Output Voltage - Peak to Peak Differential Data Output Rise Time Data Output Fall Time Signal Detect Output Voltage - Low Signal Detect Output Voltage - High Signal Detect Assert Time Signal Detect Deassert Time Symbol ICCR PDISR VOPP tr tf VOL VOH tSDA tSDD Min. Typ. 80 0.26 Max. 135 0.47 1.20 0.40 0.40 0.6 2.2 100 350 Unit mA W V ns ns V V s s Reference
0.4
2 3 3 4 4
Notes: 1. The Laser Reset Voltage is the voltage level below which the VCCT voltage must be lowered to cause the laser driver circuit to reset from an electrical/optical shutdown condition to a proper electrical/optical operating condition. The maximum value corresponds to the worst-case highest VCC voltage necessary to cause a reset condition to occur. The laser safety shutdown circuit will operate properly with transmitter VCC levels of 2.5 Vdc VCC 5.0 Vdc. 2. These outputs are compatible with 10 K, 10 KH, and 100 K ECL and PECL inputs. 3. These are 20-80% values. 4. Under recommended operating conditions.
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HFBR-53A3VEM/FM, 850 nm VCSEL Transmitter Optical Characteristics (TA = 0C to +70C, VCC = 3.14 V to 3.47 V) Parameter Output Optical Power 50/125 m, NA = 0.20 Fiber Output Optical Power 62.5/125 m, NA = 0.275 Fiber Optical Extinction Ratio Center Wavelength Spectral Width - rms Optical Rise/Fall Time RIN12 Deterministic Transmitter Jitter
Symbol POUT POUT
Min. -10 -10 9 830
Typ.
Max. -4 -4
Unit dBm avg. dBm avg. dB nm nm rms ns dB/Hz ps
Reference
1
C tr /tf
850
860 0.85 0.45 -116 188
2, 3, Figure 1
Receiver Optical Characteristics (TA = 0C to +70C, VCC = 3.14 V to 3.47 V) Parameter Symbol Input Optical Power PIN Operating Center Wavelength C Return Loss Signal Detect - Asserted PA Signal Detect - Deasserted PD Signal Detect - Hysteresis PA - PD
Min. -16 770 12 -30 1.5
Typ.
Max. 0 860 -17
Unit dBm avg. nm dB dBm avg. dBm avg. dB
Reference 4 5
Notes: 1. Optical Extinction Ratio is defined as the ratio of the average optical power of the transmitter in the high ("1") state to the low ("0") state. This Optical Extinction Ratio is expressed in decibels (dB) by the relationship 10log(Phigh avg/Plow avg). 2. These are 20-80% values and include the effect of a fourth order filter. 3. Laser transmitter pulse response characteristics are specified by an eye diagram (Figure 1). The characteristics include rise time, fall time, pulse overshoot, pulse undershoot, and ringing, all of which are controlled to prevent excessive degradation of the receiver sensitivity. 4. The receive sensitivity is measured using a worst case extinction ratio penalty while sampling at the center of the eye. 5. Return loss is defined as the minimum attenuation (dB) of received optical power for energy reflected back into the optical fiber.
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Table 1. Pinout Table Pin Symbol Functional Description Mounting Pins The mounting pins are provided for transceiver mechanical attachment to the circuit board. They are embedded in the nonconductive plastic housing and are not connected to the transceiver internal circuit, nor is there a guaranteed connection to the metallized housing in the EM and FM versions. They should be soldered into plated-through holes on the printed circuit board. 1 VEER Receiver Signal Ground Directly connect this pin to receiver signal ground plane. (For HFBR-53A5VM, VEER = VEET) 2 RD+ Receiver Data Out AC coupled - PECL compatible. 3 RD- Receiver Data Out Bar AC coupled - PECL compatible. 4 SD Signal Detect Signal Detect is a single-ended TTL output. If Signal Detect output is not used, leave it open-circuited. Normal optical input levels to the receiver result in a logic "1" output, VOH, asserted. Low input optical levels to the receiver result in a fault condition indicated by a logic "0" output VOL, deasserted. 5 VCCR Receiver Power Supply Provide +3.3 Vdc via the recommended receiver power supply filter circuit. Locate the power supply filter circuit as close as possible to the VCCR pin. 6 VCCT Transmitter Power Supply Provide +3.3 Vdc via the recommended transmitter power supply filter circuit. Locate the power supply filter circuit as close as possible to the VCCT pin. 7 TD- Transmitter Data In-Bar AC coupled - PECL compatible. Internally terminated differentially with 100 . 8 TD+ Transmitter Data In AC coupled - PECL compatible. Internally terminated differentially with 100 . 9 VEET Transmitter Signal Ground Directly connect this pin to the transmitter signal ground plane.
1 = VEER
NORMALIZED AMPLITUDE
1.3 1.0 0.8 0.5 0.2 0 -0.2 0 0.15 0.375 0.625 0.85 1.0
2 = RD+ 3 = RD4 = SD 5 = VCCR 6 = VCCT 7 = TD8 = TD+ 9 = VEET
NIC RX
TX NIC TOP VIEW
NORMALIZED TIME
NIC = NO INTERNAL CONNECTION (MOUNTING PINS)
Figure 1. Transmitter optical eye diagram mask.
Figure 2. Pin-out.
8
3.3 Vdc + GND
VEET LASER DRIVER CIRCUIT TD+ PECL INPUT 100
9 8 50
VCC2 VEE2 TD+ OUTPUT DRIVER TDR13 150 0.1 F 3.3 V + C4 C3 0.1 F 10 F R12 150
CLOCK SYNTHESIS CIRCUIT PARALLEL TO SERIAL CIRCUIT
TD- 7
50 L2 C2 0.1 F L1 C1 0.1 F + C8 10 F* 1 H 1 H
VCCT
6
HFBR-53A3VEM/FM FIBER-OPTIC TRANSCEIVER
VCCR 5
HDMP-1636A/-1646A SERIAL/DE-SERIALIZER (SERDES - 10 BIT TRANSCEIVER)
SIGNAL DETECT CIRCUIT
SD 4
TO SIGNAL DETECT (SD) INPUT AT UPPER-LEVEL-IC
RD- 3
PREAMPLIFIER POSTAMPLIFIER
50 R14
RDINPUT BUFFER RD+
CLOCK RECOVERY CIRCUIT SERIAL TO PARALLEL CIRCUIT
RD+ 2 1 V
EER
50
100
SEE HDMP-1636A/-1646A DATA SHEET FOR DETAILS ABOUT THIS TRANSCEIVER IC. NOTES: USE SURFACE-MOUNT COMPONENTS FOR OPTIMUM HIGH-FREQUENCY PERFORMANCE. USE 50 MICROSTRIP OR STRIPLINE FOR SIGNAL PATHS. LOCATE 50 TERMINATIONS AT THE INPUTS OF RECEIVING UNITS.
Figure 3. Recommended HFBR-53A3VEM/FM fiber-optic transceiver and HDMP-1636A/1646A SERDES integrated circuit transceiver interface and power supply filter circuits.
(2X) o 20.32 0.800
1.9 0.1 0.075 0.004
-A-
O0.000 M A
20.32 0.800
(9X) o
0.8 0.1 0.032 0.004
O0.000 M A
(8X) 2.54 0.100 TOP VIEW
Figure 4. Recommended board layout hole pattern.
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A
TX
XXXX-XXXX ZZZZZ LASER PROD 21CFR(J) CLASS 1 COUNTRY OF ORIGIN YYWW RX
KEY: YYWW = DATE CODE FOR MULTIMODE MODULE: XXXX-XXXX = HFBR-53xx ZZZZ = 850 nm
29.6 UNCOMPRESSED (1.16) 39.6 (1.56) MAX. 12.7 (0.50) 4.7 (0.185)
25.4 (1.00)MAX.
AREA RESERVED FOR PROCESS PLUG
12.7 (0.50)
A
SLOT WIDTH +0.1 0.25 -0.05 +0.004 -0.002 10.2 MAX. (0.40)
2.0 0.1 (0.079 0.004)
(0.010
)
2.09 UNCOMPRESSED (0.08)
9.8 MAX. (0.386) 1.3 (0.05) 3.3 0.38 (0.130 0.015) +0.25 0.46 -0.05 +0.010 -0.002 20.32 (0.80) 15.8 0.15 (0.622 0.006) 2X
9X
(0.018
)
(0.050
+0.25 1.27 -0.05 +0.010 -0.002
)
20.32 23.8 (0.937) (0.800)
8X 2.54 (0.100)
20.32 (0.800)
2X
1.3 (0.051)
DIMENSIONS ARE IN MILLIMETERS (INCHES). ALL DIMENSIONS ARE 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 5. Package outline for HFBR-53A3VEM.
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A
1.014
0.8 2x (0.032)
0.8 2x (0.032)
(
9.4 (0.374) 5.35 (0.25) MODULE PROTRUSION 27.4 0.50 (1.08 0.02)
+ 0.5 10.9 - 0.25 + 0.02 0.43 - 0.01
)
PCB BOTTOM VIEW
Figure 6. Suggested module positioning and panel cut-out for HFBR-53A3VEM.
11
A
TX
XXXX-XXXX ZZZZZ LASER PROD 21CFR(J) CLASS 1 COUNTRY OF ORIGIN YYWW RX
KEY: YYWW = DATE CODE FOR MULTIMODE MODULE: XXXX-XXXX = HFBR-53xx ZZZZ = 850 nm
39.6 (1.56) MAX. 1.01 (0.40)
12.7 (0.50) 4.7 (0.185)
25.4 (1.00)MAX.
AREA RESERVED FOR PROCESS PLUG
29.7 (1.17)
12.7 (0.50)
A
25.8 MAX. (1.02) +0.1 0.25 -0.05 +0.004 -0.002 10.2 MAX. (0.40)
SLOT DEPTH 2.2 (0.09)
SLOT WIDTH 2.0 0.1 (0.079 0.004)
(0.010
)
14.4 (0.57)
3.3 0.38 (0.130 0.015) +0.25 0.46 -0.05 +0.010 -0.002
9.8 MAX. (0.386) 20.32 (0.800)
22.0 (0.87) 15.8 0.15 (0.622 0.006) 2x
9x
(0.018
)
AREA RESERVED FOR PROCESS PLUG
(0.050
+0.25 1.27 -0.05 +0.010 -0.002
)
20.32 23.8 (0.937) (0.800)
8x 2.54 (0.100)
20.32 (0.800)
2x
1.3 (0.051)
DIMENSIONS ARE IN MILLIMETERS (INCHES). ALL DIMENSIONS ARE 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 7. Package outline for HFBR-53A3VFM.
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DIMENSION SHOWN FOR MOUNTING MODULE 1.98 FLUSH TO PANEL. THICKER PANEL WILL (0.078) RECESS MODULE. THINNER PANEL WILL PROTRUDE MODULE.
A
1.27 OPTIONAL SEPTUM (0.05) 30.2 (1.19)
KEEP OUT ZONE
0.36 (0.014)
10.82 (0.426)
14.73 (0.58)
1.82 (0.072) 13.82 (0.544)
26.4 (1.04)
BOTTOM SIDE OF PCB 12.0 (0.47) DIMENSIONS ARE IN MILLIMETERS (INCHES). ALL DIMENSIONS ARE 0.025 mm UNLESS OTHERWISE SPECIFIED.
Figure 8. Suggested module positioning and panel cut-out for HFBR-53A3VFM.
Ordering Information 850 nm VCSEL HFBR-53A3VEM HFBR-53A3VFM
(SX - Short Wavelength Laser) Extended shield, metal housing. Flush shield, metal housing.
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www.semiconductor.agilent.com Data subject to change. Copyright (c) 2001 Agilent Technologies, Inc. March 20, 2001 5988-2097EN

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